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NTF3055L108,
NVF3055L108
Power MOSFET
3.0 A, 60 V, Logic Level, N ? Channel
SOT ? 223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
? AEC Q101 Qualified ? NVF3055L108
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? Power Supplies
? Converters
? Power Motor Controls
? Bridge Circuits
http://onsemi.com
3.0 A, 60 V
R DS(on) = 120 m W
N ? Channel
D
G
S
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
Rating
Drain ? to ? Source Voltage
Drain ? to ? Gate Voltage (R GS = 1.0 M W )
Gate ? to ? Source Voltage
Symbol
V DSS
V DGR
Value
60
60
Unit
Vdc
Vdc
1
2
3
4
SOT ? 223
CASE 318E
STYLE 3
? Continuous
? Non ? repetitive (t p ≤ 10 ms)
V GS
± 15
± 20
Vdc
Vpk
MARKING DIAGRAM
Drain Current
Adc
? Continuous @ T A = 25 ° C
? Continuous @ T A = 100 ° C
? Single Pulse (t p ≤ 10 m s)
I D
I D
I DM
3.0
1.4
9.0
Apk
3055L = Device Code
A = Assembly Location
Y = Year
AYW
3055L G
G
Total Power Dissipation @ T A = 25 ° C (Note 1)
Total Power Dissipation @ T A = 25 ° C (Note 2)
Derate above 25 ° C
Operating and Storage Temperature Range
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 25 Vdc, V GS = 5.0 Vdc,
I L(pk) = 7.0 Apk, L = 3.0 mH, V DS = 60 Vdc)
P D
T J , T stg
E AS
2.1
1.3
0.014
? 55
to 175
74
Watts
Watts
W/ ° C
° C
mJ
W = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
4 Drain
Thermal Resistance
? Junction ? to ? Ambient (Note 1)
? Junction ? to ? Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
R q JA
R q JA
T L
72.3
114
260
° C/W
° C
1
Gate
2
Drain
3
Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 ″ pad size, 1 oz.
(Cu. Area 0.0995 in 2 ).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2 ? 2.4 oz. (Cu. Area 0.272 in 2 ).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 6
1
Publication Order Number:
NTF3055L108/D
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